Teknologi Guangmai profesional dalam membuat LED COB infrared 850nm 50W 100W Chip.

1. Pentingnya pembuangan panas relatif diabaikan: kita sering menggunakan heat sink yang terlalu kecil atau tidak ada heat sink sama sekali. Penting untuk diketahui: Pembuangan panas yang buruk akan menghasilkan suhu operasi yang tinggi dari chip, menghasilkan penyimpangan panjang gelombang inframerah dan mengurangi efisiensi konversi fotolistrik. Panjang gelombang yang tinggi, melebihi 850nm, menyebabkan CCD kamera's memiliki sensitivitas cahaya yang buruk, yaitu, efek penglihatan malam menjadi lebih buruk. Efisiensi konversi fotolistrik yang rendah berarti kecerahan yang tidak mencukupi. Seringkali beberapa sen heat sink akan menghasilkan efek besar dari prajurit kecil yang memberikan kontribusi besar.

2. Wrong hand touch to test the temperature: people often get shocked by themselves, because they can't bear it in less than 2-3 seconds when they put their hands on the shell (or heat sink) over 44 degrees Celsius, so I feel "Too hot", in fact, the temperature is not high and will not harm the normal operation of electronic components at all. Moreover, the higher the temperature of the housing (or the heat sink), the better the heat dissipation. "Energy is indestructible"---Imagine: The shell (or heat sink) is not hot. Where does this "heat" go? The heat stays on the chip and cannot be led out, which causes the chip to work under high temperature, and the night vision effect is poor, the light decay is large, and the lifespan is short.

3. Think that a larger chip must be "brighter" than a smaller chip: Therefore, LEDs that require large-size chips are often blindly designated. You know: the brightness depends on the current, how much current can be used? It depends on the processing of heat dissipation, that is: heat dissipation determines the current and thus the brightness, not the size of the chip determines the brightness. In theory, regardless of the size of the same brand of chips, if the current and voltage are the same (same power), the heat generated will be the same. The question is: How much area is the same heat spread? Scattered on the pinhole-sized area and the palm-sized area, the difficulty of heat dissipation is greatly different. In terms of heat dissipation, each company has different technologies, equipment, and heat dissipation materials. Therefore, each company has a different ability to deal with the same "heat" in how much area.

For example: if you provide 1.2A current on Epistar 28mil chip and 42mil chip, the voltage is slightly the same (about 1.7V), so the power is slightly the same (about 2W), and of course the heat generated is similar. The problem is: It is easier to dissipate the 2W heat on the area of the 42mil chip, but it is more difficult to disperse it on the 28mil chip. Using traditional silver glue to "bond die" packaging method, its thermal resistance is generally 20°C-30°C/W, and using eutectic technology packaging, its thermal resistance is generally 6°C-10°C/W. It shows that the heat dissipation effect is completely different. The driving currents that can be used by the above two are greatly different, and the brightness is also very different.

Tentu saja, penggunaan teknologi pembuangan panas canggih untuk memilih kemasan chip kecil dan metode mengemudi arus tinggi juga terbatas. Jika panas 2W di atas ditempatkan pada area chip 10mil, bahkan jika dikemas dengan proses eutektik, saat ini sulit untuk memanaskan Ekspor dengan lancar dan sempurna. Menantikan masa depan, dengan teknologi dan bahan pembuangan panas yang lebih baik, dimungkinkan untuk mencapai LED inframerah yang lebih canggih dengan chip yang lebih kecil dan harga yang lebih rendah, tetapi dengan efek penglihatan malam yang sama.

　　 To sum up: the night vision effect of a large-size chip may not be stronger than that of a small-size chip, depending on the quality of the heat dissipation process. Therefore, the packaging technology of the eutectic process is one of the important means for the improvement of cost performance at present, and it should be the future trend.

infrared LED COB